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3D Flexible package formation using laser micromachining |
Content: | https://pp.bme.hu/ee/article/view/853 |
---|---|
Archive: | PP Electrical Engineering |
Set: | Articles |
Title: |
3D Flexible package formation using laser micromachining
|
Creator: |
Berényi, Richárd
Illyefalvi-Vitéz, Zsolt
|
Publisher: |
Periodica Polytechnica Electrical Engineering
|
Date: |
2008-01-01
|
Subject: |
3-D package; bending window; laser processing; laser ablation of polyimide; mechanical structures in polyimide; reliability test
|
Description: | |
Language: |
English
|
Type: |
info:eu-repo/semantics/article
Peer-reviewed Article
info:eu-repo/semantics/publishedVersion
|
Format: |
application/pdf
|
Identifier: |
https://pp.bme.hu/ee/article/view/853
10.3311/pp.ee.2008-1-2.05
|
Source: |
Periodica Polytechnica Electrical Engineering; Vol. 52, No. 1-2 (2008); 39-44
|
Relation: |
https://pp.bme.hu/ee/article/view/853/472
|