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3D Flexible package formation using laser micromachining

  • Metadata
Content: https://pp.bme.hu/ee/article/view/853
Archive: PP Electrical Engineering
Set: Articles
Title:
3D Flexible package formation using laser micromachining
Creator:
Berényi, Richárd
Illyefalvi-Vitéz, Zsolt
Publisher:
Periodica Polytechnica Electrical Engineering
Date:
2008-01-01
Subject:
3-D package; bending window; laser processing; laser ablation of polyimide; mechanical structures in polyimide; reliability test
Description:
Language:
English
Type:
info:eu-repo/semantics/article
Peer-reviewed Article
info:eu-repo/semantics/publishedVersion
Format:
application/pdf
Identifier:
https://pp.bme.hu/ee/article/view/853
10.3311/pp.ee.2008-1-2.05
Source:
Periodica Polytechnica Electrical Engineering; Vol. 52, No. 1-2 (2008); 39-44
Relation:
https://pp.bme.hu/ee/article/view/853/472